SYS-1029TP-DTR

2 node in 1U Server. 4 Hot-swap 2.5" SATA3 drive bays

Anewtech Systems Supermicro Servers Supermicro Singapore SuperServer 1029TP-DTR Industrial Twin Server Supermicro Computer 2 Hot-plug System Nodes in 1U SYS-1029TP-DTR

Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:

  • Dual Socket P (LGA 3647) support  2nd Gen. Intel® Xeon® Scalable  processors (Cascade Lake/Skylake)‡
  • 16 DIMMs; up to 4TB 3DS ECC  DDR4-2933MHz† RDIMM/LRDIMM
  • 2 PCI-E 3.0 x16 slots
  • Flexible Networking support via SIOM;  Dedicated IPMI 2.0 LAN
  • 4 Hot-swap 2.5" SATA3 drive bays
  • 2 SuperDOM onboard or optional  2 M.2 carrier
  • Up to 1000W Redundant Power Supplies Titanium Level (96%)
Product Specification
Product SKU
SYS-1029TP-DTRSuperServer 1029TP-DTR
Motherboard (Two per System)Super X11DPT-PS
Processor/Cache (per Node)
CPUDual Socket P (LGA 3647)
2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake),Dual UPI up to 10.4GT/s
Support CPU TDP 70-145W
CoresUp to 28 Cores
Note BIOS version 3.0a or above is required to support 2nd Gen. Intel® Xeon® Scalable processors
System Memory (per Node)
Memory Capacity16 DIMM slots
Up to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
Memory Type2933/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note 2933MHz in two DIMMs per channel can be achieved by using memory purchased from us
On-Board Devices (per Node)
ChipsetIntel® C621 chipset
SATASATA3 (6Gbps); RAID 0, 1, 5, 10
Network ControllersBarebones and Complete System must have at least one SIOM card installed per node
IPMISupport for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
GraphicsASPEED AST2500 BMC
Input / Output (per Node)
SATA4 SATA3 (6Gbps) ports
LAN1 RJ45 Dedicated IPMI LAN port
USB2 USB 3.0 ports (rear)
VGA1 VGA port
Serial Port / Header1 Fast UART 16550 port / 1 Header (internal)
Others2 SuperDOM support on the motherboard
1 NVMe or 2 SATA M.2 (22x80/60/42 mm) support with option part: AOC-SMG3-2H8M2
M.2 and SuperDOM are for OS boot and they cannot coexist
System BIOS
BIOS TypeAMI 32MB SPI Flash ROM
Management
SoftwareIntel® Node Manager
IPMI 2.0
KVM with dedicated LAN
NMI
SSM, SPM , SUM
SuperDoctor® 5
Watchdog
Power ConfigurationsACPI Power Management
PC Health Monitoring
CPUMonitors for CPU Cores, Chipset Voltages, Memory.
4+1 Phase-switching voltage regulator
FANFans with tachometer monitoring
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
TemperatureMonitoring for CPU and chassis environment
Thermal Control for fan connectors
Chassis
Form Factor1U Rackmount
ModelCSE-809H-R1K05P3
Dimensions and Weight
Width17.2" (437mm)
Height1.7" (88mm)
Depth28.25" (718mm)
Package29.6" (W) x 8" (H) x 38.4" (L)
WeightGross Weight: 48.1 lbs (21.9 kg)
Net Weight: 33.5 lbs (15.2 kg)
Front Panel
ButtonsPower On/Off button
UID button
LEDsPower status LED
HDD activity LED
Network activity LEDs
Universal Information (UID) LED
Expansion Slots (per Node)
PCI-Express2 PCI-E 3.0 x16 Low-profile slots
1 SIOM card support Note: Barebones and Complete System must bundle with SIOM
(With only one CPU installed, SXB2 M.2 and SXB4 riser card slots not function)
Drive Bays (per Node)
Hot-swap4 Hot-swap 2.5" SAS3/SATA3 drive bays
BackplaneSAS3 backplane
System Cooling
Fans3 Heavy duty counter rotating fans with air shroud and optimal fan speed control
PowerStick Power Supply1000W 1U Redundant Power Supplies with PMBus
Total Output Power800W: 100 – 127Vac
1000W: 200 – 240Vac
Dimension (W x H x L)38 x 40 x 360 mm
Input100-127Vac / 9-7.5A / 50-60Hz
200-240Vac / 6-5A / 50-60Hz
+12VMax: 66.7A / Min: 0A (100-127Vac)
Max: 83A / Min: 0A (200-240Vac)
+5VsbMax: 4A / Min: 0A
Output TypeGold Finger Connector (16 Power Pin, 14 Signal Pin)
Certification  Titanium Level
Operating Environment
RoHSRoHS Compliant
Environmental Spec.Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)