||20-slot form factor supports one PICMG 1.3 System Host Board
||Board dimensions: 16.4” x 11.9”
The nominal backplane thickness is 0.080”; however, the backplane mounting holes are recessed 0.018” on the bottom to provide an effective PCB thickness of 0.062” for use in the chassis design process.
||16.4″ x 11.9″ (20-slot)
||One, x4 PCIe slot (x16 mechanical) from a Trenton SHB via an IOB31 module
One, x4 PCIe slot (x16 mechanical) driven directly from SHB
Twelve, x4 PCIe slots (x16 mechanical) from PCIe switches
Four, x8 PCIe slots (x16 mechanical) from PCIe switches
See datasheet or mechanical layout diagram for detailed slot routing information.
||4 – x8 PCI Express 1.1 electrical / x16 mech. connectors
12 – x4 PCI Express 1.1 electrical / x16 mech. connectors
1 – x4 PCI Express 2.0/1.1 electrical / x16 mech. connectors
1 – x4/x1 PCI Express 2.0/1.1 electrical# / x8 mech. connector
#From IOB3x on SBC / link width SBC dependent
||Dual-processor SBCs: BXT7059*, JXT6966*, MCXT, MCXT-E, SLT
Single-processor SBCs: TSB7053, BXTS7059*, JXTS6966*, MCXI, SLI
*Note: PCI Express cards with card lengths of 4.5″ (11.43cm) or less can be used in slot PCIe1 of the backplane. Card lengths greater than 4.5″ must be used in the other backplane slots.
||PICMG 1.3 Combo or Server-class
||+5V, +5V AUX, +12V and +3.3V power connection
|Agency Approvals & Compliance
||Designed for UL60950 and CAN/CSA C22.2 No.60950-00, EN55022:1998 Class B, EN61000-4-2:1995, EN61000-4-3:1997, EN61000-4-4:1995, EN61000-4-5:1995, EN61000-4-6:1996, EN61000-4-11:1994
||Operating Temp: 0°C to 60°C
Storage Temp: -20°C to 70°C
Humidity: 5% to 90%, non condensing
Trenton’s BPX6806 is a lead free, RoHS compliant backplane.