HDEC - 4 Slots backplane. 4 - x16 PCI Express 3.0 slots. Four separate HDEC processor boards in a 5U system



  • HDEC Series large format backplane supports four separate dual-processor HDEC Series SHB and one x16 PCIe gen 3 slot per segment. This is perfect for applications where four separate dual Xeon processors (8 CPUs total) are needed in a 5U rackspace.
  • All card slots are designed for the Gen3 PCIe electrical interface and are equipped with x16 PCIe mechanical connectors. All PCIe slots are directly connected to the single board computer.



Model HDB8237
Form Factor HDEC Series large format backplane has four independent computing segments.  Each backplane segment supports a dual-processor HDEC Series SHB and a x16 PCI Express option card.  A cluster computing system built with the HDB8237 can support up to four independent SHB and PCI Express cards.  All card slots are designed for the Gen3 PCIe electrical interface and are equipped with x16 PCIe mechanical connectors.
Mechanical Board dimensions: 17mm x 28mm
The nominal backplane thickness is 0.080”; however, the backplane mounting holes are recessed 0.018” on the bottom to provide an effective PCB thickness of 0.062” for use in the chassis design process.
Size 417mm x 328mm (large format)
Configuration Four segment backplane with one x16 PCI Express card slot, and one HDEC Series system host board slot in each backplane segment
Each backplane segment’s PCIe slot is driven with a native PCIe 3.0 link direct from the processors on a compatible HDEC Series system host board; such as Trenton’s HEP8225, plugged into the segment’s SHB slot.
Card Slots 4 – x16 PCI Express 3.0/2.0/1.1 electrical / x16 mech. connectors (one per backplane segment)
Indicators The following LED SHB and system status indicators are available within each backplane segment:
1 – System fan present LED
1 – System Host Board present LED
4 – Incoming system power status LEDs for the 3.3V, 5V, 12V and 5V AUX supply levels
The following LED power indicators are available within each backplane segment:
+5V, +5V AUX, +12V, and +3.3V system power connection and status
Connectors The table below lists the device I/O and system status connections available within each backplane segment when using a Trenton HDEC Series system host board like the HEP8225.
4 -SATA/600 system headers 2 – USB3 interface system header connections
1 – System fan header 4 – ACPI control headers
1 – Clear CMOS header 1 – I2C header allows access to all four segments
1 – Alarm status headers for the FAN signals (backplane segment 2 location)
Suggested SHB/SBCs Trenton model – HEP8225
SHB Configuration Any compatible HDEC Series, dual-processor system host board including Trenton’s HEP8225
Agency Approvals & Compliance Designed for UL60950 and CAN/CSA C22.2 No.60950-00, EN55022:1998 Class B, EN61000-4-2:1995, EN61000-4-3:1997, EN61000-4-4:1995, EN61000-4-5:1995, EN61000-4-6:1996, EN61000-4-11:1994
Power Connectors Each backplane segment contains the following system power supply connections:
ATX/EPS power source – one right-angle or vertical 24-position ATX/EPS connector
+12V AUX power source – one right-angle or vertical 8-position connectors
Operating Temperature Operating Temp:  0°C to 50°C with standard cooling solution and 350LFM of continuous airflow
Environmental Airflow: 350LFM continuous airflow
Storage Temp: -40° to 70°C
Humidity: 5% to 90% non-condensing
Trenton’s HDB8237 is a lead free, RoHS compliant backplane.