SYS-1029TP-DTR

1U Twin Server. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors

Anewtech-twin-server-SYS-1029TP-DTR

Features

Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:

  • Dual Socket P (LGA 3647) support  2nd Gen. Intel® Xeon® Scalable  processors (Cascade Lake/Skylake)‡
  • 16 DIMMs; up to 4TB 3DS ECC  DDR4-2933MHz† RDIMM/LRDIMM
  • 2 PCI-E 3.0 x16 slots
  • Flexible Networking support via SIOM;  Dedicated IPMI 2.0 LAN
  • 4 Hot-swap 2.5" SATA3 drive bays
  • 2 SuperDOM onboard or optional  2 M.2 carrier
  • Up to 1000W Redundant Power Supplies Titanium Level (96%)

Specification

Anewtech-twin-server-SYS-1029TP-DTR

Product SKU
SYS-1029TP-DTR SuperServer 1029TP-DTR
Motherboard (Two per System) Super X11DPT-PS
Processor/Cache (per Node)
CPU Dual Socket P (LGA 3647)
2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake),Dual UPI up to 10.4GT/s
Support CPU TDP 70-145W
Cores Up to 28 Cores
Note BIOS version 3.0a or above is required to support 2nd Gen. Intel® Xeon® Scalable processors
System Memory (per Node)
Memory Capacity 16 DIMM slots
Up to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
Memory Type 2933/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
On-Board Devices (per Node)
Chipset Intel® C621 chipset
SATA SATA3 (6Gbps); RAID 0, 1, 5, 10
Network Controllers Barebones and Complete System must have at least one SIOM card installed per node
IPMI Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics ASPEED AST2500 BMC
Input / Output (per Node)
SATA 4 SATA3 (6Gbps) ports
LAN 1 RJ45 Dedicated IPMI LAN port
USB 2 USB 3.0 ports (rear)
VGA 1 VGA port
Serial Port / Header 1 Fast UART 16550 port / 1 Header (internal)
Others 2 SuperDOM support on the motherboard
1 NVMe or 2 SATA M.2 (22x80/60/42 mm) support with option part: AOC-SMG3-2H8M2
M.2 and SuperDOM are for OS boot and they cannot coexist
System BIOS
BIOS Type AMI 32MB SPI Flash ROM
Management
Software Intel® Node Manager
IPMI 2.0
KVM with dedicated LAN
NMI
SSM, SPM , SUM
SuperDoctor® 5
Watchdog
Power Configurations ACPI Power Management
PC Health Monitoring
CPU Monitors for CPU Cores, Chipset Voltages, Memory.
4+1 Phase-switching voltage regulator
FAN Fans with tachometer monitoring
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
Temperature Monitoring for CPU and chassis environment
Thermal Control for fan connectors
Chassis
Form Factor 1U Rackmount
Model CSE-809H-R1K05P3
Dimensions and Weight
Width 17.2" (437mm)
Height 1.7" (88mm)
Depth 28.25" (718mm)
Package 29.6" (W) x 8" (H) x 38.4" (L)
Weight Gross Weight: 48.1 lbs (21.9 kg)
Net Weight: 33.5 lbs (15.2 kg)
Front Panel
Buttons Power On/Off button
UID button
LEDs Power status LED
HDD activity LED
Network activity LEDs
Universal Information (UID) LED
Expansion Slots (per Node)
PCI-Express 2 PCI-E 3.0 x16 Low-profile slots
1 SIOM card support Note: Barebones and Complete System must bundle with SIOM
(With only one CPU installed, SXB2 M.2 and SXB4 riser card slots not function)
Drive Bays (per Node)
Hot-swap 4 Hot-swap 2.5" SAS3/SATA3 drive bays
Backplane SAS3 backplane
System Cooling
Fans 3 Heavy duty counter rotating fans with air shroud and optimal fan speed control
PowerStick Power Supply 1000W 1U Redundant Power Supplies with PMBus
Total Output Power 800W: 100 – 127Vac
1000W: 200 – 240Vac
Dimension (W x H x L) 38 x 40 x 360 mm
Input 100-127Vac / 9-7.5A / 50-60Hz
200-240Vac / 6-5A / 50-60Hz
+12V Max: 66.7A / Min: 0A (100-127Vac)
Max: 83A / Min: 0A (200-240Vac)
+5Vsb Max: 4A / Min: 0A
Output Type Gold Finger Connector (16 Power Pin, 14 Signal Pin)
Certification   Titanium Level
Operating Environment
RoHS RoHS Compliant
Environmental Spec. Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)