DP Intel 8U GPU Server with Intel Data Center GPU Max 1550

Anewtech-Systems GPU-Server Supermicro SYS-821GV-TNR  Supermicro Singapore GPU Server Supermicro Servers
  • 5th/4th Gen Intel® Xeon® Scalable processors With PCIE Gen 5 Platform
  • GPU Memory Bandwidth: 3276.8 GB/s
  • GPU Memory: 1TB HBM2
  • GPU to GPU Interconnect: 742 GB/s XeLink Scale Up Bandwidth
  • High Density Computing: 8 x Intel® Data Center GPU Max 1550 (600W) OAM
  • Open Ecosystem with oneAPI
  • Performance: 6.7 petaFLOPS FP16/BF16
  • 32x DIMM slots, ECC DDR5 up to 8TB and 4800MTS
Product Specification
Product SKUsSuperServer SYS-821GV-TNR (Silver)
MotherboardSuper X13DEG-PVC
CPUDual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
Core CountUp to 64C/128T; Up to 128MB Cache per CPU
NoteSupports up to 350W TDP CPUs (Air Cooled)
Max GPU Count8 onboard GPU(s)
Supported GPUIntel OAM: Data Center GPU Max 1550
CPU-GPU InterconnectPCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU InterconnectIntel® Xe Link Bridges
System Memory
MemorySlot Count: 32 DIMM slots
Max Memory (2DPC): Up to 8TB 5600MT/s ECC DDR5 RDIMM
Memory Voltage1.1 V
On-Board Devices
ChipsetIntel® C741
Network Connectivity2x 10GbE BaseT with Intel® X550-AT2 (optional)
Input / Output
LAN1 RJ45 1GbE (Dedicated IPMI port)
USB2 USB 3.2 Gen1 port(s) (2 Front_USB)
Video1 VGA port(s)
System BIOS
HardwareTrusted Platform Module (TPM) 2.0
PC Health Monitoring
CPU8+4 Phase-switching voltage regulator
FANFans with tachometer monitoring
Pulse Width Modulated (PWM) fan connectors
Status monitor for speed control
TemperatureMonitoring for CPU and chassis environment
Thermal Control for fan connectors
Form Factor8U Rackmount
Dimensions and Weight
Height13.8" (356mm)
Width17.7" (447mm)
Depth33.2" (843mm)
Package27.6" (H) x 51" (W) x 29.5" (D)
WeightNet Weight: 130.07 lbs (59 kg) 
Gross Weight: 196.21 lbs (89 kg)
Available ColorSilver
Front Panel
ButtonsUID button
Expansion Slots
PCI-Express (PCIe)8 PCIe 5.0 x16 LP slot(s)
4 PCIe 5.0 x16 FHHL slot(s)
Drive Bays / Storage
Hot-swap19x 2.5" hot-swap NVMe/SATA drive bays
(16x 2.5" NVMe dedicated)
M.22 M.2 NVMe OR 2 M.2 SATA3M-Key, 22110, 2280
System Cooling
Fans10 Removable heavy-duty 8CM Fan(s)
Power Supply6x 3000W Redundant Titanium Level power supplies
Dimension (W x H x L)106.5 x 82.1 x 245.5 mm
AC Input3000W: 0240Vdc / 50-60Hz (for CQC only)
2880W: 200-207Vac / 50-60Hz 
3000W: 207-240Vac / 50-60Hz
+12VMax: 91.66A / Min: 0A (200Vdc-240Vdc)
12V SBMax: 3A / Min: 0A
Output TypeBackplanes (gold finger)
Operating Environment
Environmental Spec.Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) 
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) 
Operating Relative Humidity: 8% to 90% (non-condensing) 
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Optimized for Large-Scale AI Training, Generative AI and HPC

GPU SuperServer SYS-821GV-TNR


8U Dual Processor (5th/4th Gen Intel® Xeon) System with 8 Intel® Max Series 1550 GPU, Ponte Vecchio

Key Features

  • GPU: 8 Intel® Data Center GPU Max 1550 (600W) OAM (Codenamed Ponte Vecchio)
  • CPU: Dual 4th Gen Intel® Xeon® Scalable Processors
  • Memory: 32 DIMM slots; up to 8TB DDR5
  • Drives: Up to 24 hot-swap 2.5" NVMe/SATA
  • Support for GPU/CPU air cooling and liquid cooling

5th Gen Intel® Xeon® Scalable Processors

  • Up to 64 cores and 385W TDP per CPU
  • Support for Intel Xeon® Max Series CPUs with High Bandwidth Memory
  • Support for PCIe 5.0, DDR5 and CXL 1.1
  • Built on the Intel® 7 process
  • Built in accelerators:
    • Intel AMX
    • Intel® Dynamic Load Balancer
    • Intel® QuickAssist
    • Technology (QAT)
    • Intel vRAN Boost

Delivering Solutions Optimized for Tomorrow’s Data Center Workloads

Complete Rack-Scale Solutions

  • Full design, integration, validation and testing services for rack-scale and multi-rack clusters
  • Complete rack-scale liquid cooling solutions developed in house

Performance and Energy Optimized

  • Enhanced thermal capacity to support the highest performing CPUs and GPUs
  • Optimized to run in high-temperature data center environments up to 40°C

Improved Security and Manageability

  • Industry-standard compliance for hardware and silicon Root of Trust (RoT)
  • Cryptographical attestation of components throughout the entire supply chain

Supports Open Industry Standards

  • The latest industry technologies including PCIe 5.0, DDR5, and CXL
  • Open Compute Project (OCP) standards including OCP 3.0, OAM, ORV2 and OSF as well as Open BMC