SYS-821GV-TNR
DP Intel 8U GPU Server with Intel Data Center GPU Max 1550
- 5th/4th Gen Intel® Xeon® Scalable processors With PCIE Gen 5 Platform
- GPU Memory Bandwidth: 3276.8 GB/s
- GPU Memory: 1TB HBM2
- GPU to GPU Interconnect: 742 GB/s XeLink Scale Up Bandwidth
- High Density Computing: 8 x Intel® Data Center GPU Max 1550 (600W) OAM
- Open Ecosystem with oneAPI
- Performance: 6.7 petaFLOPS FP16/BF16
- 32x DIMM slots, ECC DDR5 up to 8TB and 4800MTS
Datasheet
Product Specification
| Product SKUs | SuperServer SYS-821GV-TNR (Silver) |
| Motherboard | Super X13DEG-PVC |
| Processor | |
| CPU | Dual Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors |
| Core Count | Up to 64C/128T; Up to 128MB Cache per CPU |
| Note | Supports up to 350W TDP CPUs (Air Cooled) |
| GPU | |
| Max GPU Count | 8 onboard GPU(s) |
| Supported GPU | Intel OAM: Data Center GPU Max 1550 |
| CPU-GPU Interconnect | PCIe 5.0 x16 CPU-to-GPU Interconnect |
| GPU-GPU Interconnect | Intel® Xe Link Bridges |
| System Memory | |
| Memory | Slot Count: 32 DIMM slots Max Memory (2DPC): Up to 8TB 5600MT/s ECC DDR5 RDIMM |
| Memory Voltage | 1.1 V |
| On-Board Devices | |
| Chipset | Intel® C741 |
| Network Connectivity | 2x 10GbE BaseT with Intel® X550-AT2 (optional) |
| Input / Output | |
| LAN | 1 RJ45 1GbE (Dedicated IPMI port) |
| USB | 2 USB 3.2 Gen1 port(s) (2 Front_USB) |
| Video | 1 VGA port(s) |
| System BIOS | |
| BIOS Type | AMI 32MB SPI Flash EEPROM |
| Security | |
| Hardware | Trusted Platform Module (TPM) 2.0 |
| PC Health Monitoring | |
| CPU | 8+4 Phase-switching voltage regulator |
| FAN | Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control |
| Temperature | Monitoring for CPU and chassis environment Thermal Control for fan connectors |
| Chassis | |
| Form Factor | 8U Rackmount |
| Model | CSE-GP801TS-R000NPF |
| Dimensions and Weight | |
| Height | 13.8" (356mm) |
| Width | 17.7" (447mm) |
| Depth | 33.2" (843mm) |
| Package | 27.6" (H) x 51" (W) x 29.5" (D) |
| Weight | Net Weight: 130.07 lbs (59 kg) Gross Weight: 196.21 lbs (89 kg) |
| Available Color | Silver |
| Front Panel | |
| Buttons | UID button |
| Expansion Slots | |
| PCI-Express (PCIe) | 8 PCIe 5.0 x16 LP slot(s) 4 PCIe 5.0 x16 FHHL slot(s) |
| Drive Bays / Storage | |
| Hot-swap | 19x 2.5" hot-swap NVMe/SATA drive bays (16x 2.5" NVMe dedicated) |
| M.2 | 2 M.2 NVMe OR 2 M.2 SATA3M-Key, 22110, 2280 |
| System Cooling | |
| Fans | 10 Removable heavy-duty 8CM Fan(s) |
| Power Supply | 6x 3000W Redundant Titanium Level power supplies |
| Dimension (W x H x L) | 106.5 x 82.1 x 245.5 mm |
| AC Input | 3000W: 0240Vdc / 50-60Hz (for CQC only) 2880W: 200-207Vac / 50-60Hz 3000W: 207-240Vac / 50-60Hz |
| +12V | Max: 91.66A / Min: 0A (200Vdc-240Vdc) |
| 12V SB | Max: 3A / Min: 0A |
| Output Type | Backplanes (gold finger) |
| Operating Environment | |
| Environmental Spec. | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
Optimized for Large-Scale AI Training, Generative AI and HPC
GPU SuperServer SYS-821GV-TNR
8U Dual Processor (5th/4th Gen Intel® Xeon) System with 8 Intel® Max Series 1550 GPU, Ponte Vecchio
Key Features
- GPU: 8 Intel® Data Center GPU Max 1550 (600W) OAM (Codenamed Ponte Vecchio)
- CPU: Dual 4th Gen Intel® Xeon® Scalable Processors
- Memory: 32 DIMM slots; up to 8TB DDR5
- Drives: Up to 24 hot-swap 2.5" NVMe/SATA
- Support for GPU/CPU air cooling and liquid cooling
5th Gen Intel® Xeon® Scalable Processors
- Up to 64 cores and 385W TDP per CPU
- Support for Intel Xeon® Max Series CPUs with High Bandwidth Memory
- Support for PCIe 5.0, DDR5 and CXL 1.1
- Built on the Intel® 7 process
- Built in accelerators:
- Intel AMX
- Intel® Dynamic Load Balancer
- Intel® QuickAssist
- Technology (QAT)
- Intel vRAN Boost
Delivering Solutions Optimized for Tomorrow’s Data Center Workloads
Complete Rack-Scale Solutions
- Full design, integration, validation and testing services for rack-scale and multi-rack clusters
- Complete rack-scale liquid cooling solutions developed in house
Performance and Energy Optimized
- Enhanced thermal capacity to support the highest performing CPUs and GPUs
- Optimized to run in high-temperature data center environments up to 40°C
Improved Security and Manageability
- Industry-standard compliance for hardware and silicon Root of Trust (RoT)
- Cryptographical attestation of components throughout the entire supply chain
Supports Open Industry Standards
- The latest industry technologies including PCIe 5.0, DDR5, and CXL
- Open Compute Project (OCP) standards including OCP 3.0, OAM, ORV2 and OSF as well as Open BMC