ID-DDR5 RDIMM VLP
Interface: DDR5, Form Factor: RDIMM VLP, Function: Registered Memory with ECC
- Saves 40% of system space with VLP (Very Low Profile) design
- Speeds up to 5600MT/s with capacities up to 32GB
- HDI and Ultra Low Loss PCB minimize signal interference
- Identifies the optimal PMIC solution through Power Integrity (PI) testing
- Selects the ideal SPD hub through Signal Integrity (SI) testing
Product Specification
| Model Name | DDR5 RDIMM VLP |
| DDR Generation | DDR5 Memory |
| DIMM Type | RDIMM VLP |
| Speed | 4800 MT/s, 5600 MT/s |
| Density | 16GB, 32GB |
| Function | Registered Memory with ECC |
| Pin Number | 288pin |
| Bus Width | x80 |
| Voltage | 1.1V |
| PCB Height | 0.738 Inches |
| Operating Temperature | 0°C ~ 95°C (Tc) |
| 30μ” Gold Finger | Y |
| Anti-Sulfuration | Y |
BORN FOR SUPERIOR PERFORMANCE
The DDR5 RDIMM VLP offers a very low-profile design and the industry‘s fastest memory speeds with 4800MT/s or 5600MT/s. It is fully compatible with the Intel® Purely platform and 1U devices. The modules are available in 16GB and 32GB capacities.
40% SPACE SAVING, COOLING BOOST AND SYSTEM FLEXIBILITY
The DDR5 RDIMM VLP, standing at just 1.8cm in height, achieves a 40% reduction in space usage. This low-profile design reduces PCB usage and decreases resource consumption. It also improves airflow, enhances memory cooling, conserves fan energy, and offers greater flexibility in system configuration.
Ordering Information
| P/N | IC Config. | Rank | Temp. | Description |
| M5R0-AGS2CCVP | 2G x 8 | 1R x 8 | 0°C ~ 95°C (Tc) | DDR5 4800 16GB RDIMM VLP |
| M5R0-AGM2CCVP | 2G x 8 | 1R x 8 | 0°C ~ 95°C (Tc) | DDR5 4800 16GB RDIMM VLP |
| M5R0-BGS2DCZQ | 2G x 8 | 2R x 8 | 0°C ~ 95°C (Tc) | DDR5 5600 32GB RDIMM VLP |
| M5R0-BGM2DCZQ | 2G x 8 | 2R x 8 | 0°C ~ 95°C (Tc) | DDR5 5600 32GB RDIMM VLP |
LOW PROFILE SERIES
OPTIMIZED FOR SPACE-CONSTRAINED COMPUTING
As the demand for high-performance computing and complex data-driven applications increases, space constraints have become a significant challenge.
Low Profile Series tackles these issues with its innovative low-profile design, offering space-saving benefits that enhance system flexibility, improve thermal management, and optimize heat dissipation.
40% SYSTEM SPACE SAVING
With a compact 0.74-inch PCB, the Low Profile Series enables denser memory configurations. This design allows server administrators to maximize memory capacity in constrained spaces without compromising performance.
The saved space also facilitates flexible server designs, optimizing deployments for maximum efficiency and scalability.
IMPROVED THERMAL EFFICIENCY
The compact design of the VLP (Very Low Profile) / ULP (Ultra Low Profile) Series provides greater flexibility in system layout and configuration.
Positioned close to heat sources like CPUs and GPUs, these modules enhance airflow around components, improving cooling efficiency and reducing overall system temperature. This optimization boosts system stability and reliability while supporting flexible server designs.
LOWER SYSTEM POWER CONSUMPTION
The Low Profile Series enhances thermal efficiency, leading to reduced system power consumption. By improving cooling and minimizing reliance on fans and other cooling mechanisms, these modules lower energy costs while contributing to a sustainable and reliable server infrastructure.
