SYS-222BT-HNR-LCC

2U 4-Node BigTwin Server with 6 hot-swap 2.5" NVMe drives per node
Anewtech-Systems-Twin-Server-Supermicro-SYS-222BT-HNR-LCC

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

  • Dual Socket E2 (LGA-4710) Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores up to 350W with liquid cooling
  • Up to 16 DIMMs supporting up to 4TB DDR5-6400 in 1DPC
  • Flexible networking with up to 1 OCP 3.0 compatible AIOM slots
  • Up to 2 PCIe 5.0 x16 LP + 1 PCIe 5.0 x16 AIOM slots
  • Up to 6 front hot-swap 2.5" NVMe drive bays
  • 2 Redundant 3600W Titanium Level power supplies
  • 2U Rackmount chassis with 28.75" (730mm) depth

Key Applications

  • All-Flash NVMe Hyperconverged Infrastructure
  • Container-as-a-Service; Application Accelerator
  • High-Performance File System
  • Diskless HPC Clusters
Product Specification
Anewtech-Systems-Twin-Server-Supermicro-SYS-222BT-HNR-LCC-BigTwin-Liquid-cooled-serversAnewtech-Systems-Twin-Server-Supermicro-SYS-222BT-HNR-LCC-BigTwin-Liquid-cooled-serverAnewtech-Systems-Twin-Server-Supermicro-SYS-222BT-HNR-LCC-Liquid-cooled-server
Product SKUSuperserver SYS-222BT-HNR-LCC
MotherboardSuper X14DBT-B
Processor
CPUDual Socket E2 (LGA-4710)
Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores
Core CountP-cores: Up to 86C/172T; Up to 336MB Cache per CPU
E-cores: Up to 144C/144T; Up to 108MB Cache per CPU
NoteSupports up to 350W TDP CPUs (Liquid Cooled)​
System Memory (per Node)
MemorySlot Count: 16 DIMM slots
Max Memory (1DPC): Up to 4TB 6400MT/s ECC DDR5 RDIMM
Memory Voltage1.1V
On-Board Devices (per Node)
ChipsetSystem on Chip
Network ConnectivityVia AIOM
Input / Output (per Node)
LAN1 RJ45 1 GbE Dedicated BMC LAN port
USB2 USB 3.0 Gen2 Type-A ports(Rear)
Video1 VGA port
System BIOS
BIOS TypeAMI 32MB Flash ROM
Management
SoftwareSuperCloud Composer®
Supermicro Server Manager (SSM)
Super Diagnostics Offline (SDO)
Supermicro Thin-Agent Service (TAS)
SuperServer Automation Assistant (SAA) New!
Power configurationsACPI/APM Power Management
Security
HardwareTrusted Platform Module (TPM) 2.0
Silicon Root of Trust (RoT) – NIST 800-193 Compliant
FeaturesCryptographically Signed Firmware
Secure Boot
Secure Firmware Updates
Automatic Firmware Recovery
Supply Chain Security: Remote Attestation
Runtime BMC Protections
System Lockdown
PC Health Monitoring
FANFans with tachometer monitoring
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
TemperatureMonitoring for CPU and chassis environment
CPUMonitors for CPU Cores, Chipset Voltages, Memory.
8+4 Phase-switching voltage regulator
Chassis
Form Factor2U Rackmount
ModelCSE-217BQ2-R3K60P
Dimensions and Weight
Height3.47" (88 mm)
Width17.68" (449 mm)
Depth28.75" (730 mm)
Package9.76" (H) x 24.65" (W) x 45.28" (D)
WeightGross Weight: 96.6 lbs (43.8 kg)
Net Weight: 66.1 lbs (30 kg)
Available ColorBlack front & silver body
Front Panel
LEDHDD activity LED
Network activity LEDs
Power status LED
Universal Information (UID) LED
ButtonsPower On/Off button
UID button
Expansion Slots (per Node)
PCI-Express (PCIe) ConfigurationDefault
1 PCIe 5.0 x16 LP slot 
1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
Option A
2 PCIe 5.0 x16 LP slots 
1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
Drive Bays / Storage (per Node)
Drive Bays ConfigurationDefault: Total 6 bays
6 front hot-swap 2.5" PCIe 5.0 NVMe drive bays
M.22 M.2 PCIe 5.0 x4 NVMe slots (M-key 22110(default); VROC required for RAID)
System Cooling
Fans4x 16K RPM Counter Rotating 80x80x56mm Fan(s)
Air Shroud4 Air Shrouds
Liquid CoolingDirect to Chip (D2C) Cold Plate
Power Supply
2x 3600W2x 3600W Redundant (1 + 1) Titanium Level (96%) power supplies
Operating Environment
ROHSRoHS Compliant
Environmental Spec.Operating Temperature: 10°C to 35°C (50°F to 95°F)
Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
Operating Relative Humidity: 8% to 80% (non-condensing)
Non-operating Relative Humidity: 8% to 90% (non-condensing)