SYS-421GU-TNXR
DP Intel 4U Direct-connect PCIe GPU Server with up to 8 GPUs
- 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 4800MHz ECC DDR5
- 8 PCIe Gen 5.0 X16 LP Slots
- Flexible networking options
- 2 M.2 NVMe and SATA for boot drive only
- 6x 2.5" Hot-swap NVMe/SATA/SAS drive bays
Datasheet
Product Specification
| Product SKUs | SuperServer SYS-421GU-TNXR (Black Front & Silver Body) |
| Motherboard | Super X13DGU |
| Processor | |
| CPU | Dual Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors |
| Core Count | Up to 56C/112T; Up to 112.5MB Cache per CPU |
| Note | Supports up to 350W TDP CPUs (Air Cooled) Supports up to 350W TDP CPUs (Liquid Cooled) |
| GPU | |
| Max GPU Count | 4 onboard GPU(s) |
| Supported GPU | NVIDIA SXM: HGX H100 4-GPU (80GB) |
| CPU-GPU Interconnect | PCIe 5.0 x16 CPU-to-GPU Interconnect |
| GPU-GPU Interconnect | NVIDIA® NVLink® |
| System Memory | |
| Memory | Slot Count: 32 DIMM slots Max Memory (2DPC): Up to 8TB 5600MT/s ECC DDR5 |
| Memory Voltage | 1.1 V |
| On-Board Devices | |
| Chipset | Intel® C741 |
| Network Connectivity | 2x 10GbE BaseT with Intel® X710-AT2 |
| IPMI | Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support |
| Input / Output | |
| Video | 1 VGA port(s) |
| System BIOS | |
| BIOS Type | AMI 32MB SPI Flash EEPROM |
| Management | |
| Software | IPMI 2.0 KVM with dedicated LAN Super Diagnostics Offline SuperDoctor® 5 Supermicro Update Manager (SUM) Supermicro Power Manager (SPM) Supermicro Server Manager (SSM) Redfish API |
| Power Configurations | ACPI Power Management Power-on mode for AC power recovery |
| Security | |
| Hardware | Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant |
| Features | Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown |
| PC Health Monitoring | |
| CPU | 8+4 Phase-switching voltage regulator Monitors for CPU Cores, Chipset Voltages, Memory |
| FAN | Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control |
| Temperature | Monitoring for CPU and chassis environment Thermal Control for fan connectors |
| Chassis | |
| Form Factor | 4U Rackmount |
| Model | CSE-458GTS-R3K06P |
| Dimensions and Weight | |
| Height | 7" (175.6mm) |
| Width | 17.67" (449mm) |
| Depth | 32.79" (833mm) |
| Package | 14.57" (H) x 27.55" (W) x 49.6" (D) |
| Weight | Net Weight: 105 lbs (48 kg) Gross Weight: 140 lbs (64 kg) |
| Available Color | Black Front & Silver Body |
| Front Panel | |
| Buttons | Power On/Off button System Reset button |
| LEDs | Hard drive activity LED Network activity LEDs Power status LED System Overheat & Power Fail LED |
| Expansion Slots | |
| PCI-Express (PCIe) | 1 PCIe 5.0 x16 LP slot(s) 7 PCIe 5.0 X16 slot(s) |
| Drive Bays / Storage | |
| Hot-swap | 6x 2.5" hot-swap NVMe/SATA drive bays (6x 2.5" NVMe hybrid) |
| M.2 | 2 M.2 NVMe OR 2 M.2 SATA3 |
| System Cooling | |
| Fans | 5 heavy duty fans with optimal fan speed control |
| Air Shroud | 1 Air Shroud(s) |
| Liquid Cooling | Direct to Chip (D2C) Cold Plate (optional) |
| Power Supply | 4x 3000W Redundant Titanium Level power supplies |
| Dimension (W x H x L) | 106.5 x 82.1 x 245.5 mm |
| AC Input | 3000W: 0240Vdc / 50-60Hz (for CQC only) 2880W: 200-207Vac / 50-60Hz 3000W: 207-240Vac / 50-60Hz |
| +12V | Max: 91.66A / Min: 0A (200Vdc-240Vdc) |
| 12V SB | Max: 3A / Min: 0A |
| Output Type | Backplanes (gold finger) |
| Operating Environment | |
| Environmental Spec. | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
HGX H100 Systems - Designed for Largest AI-fused HPC Clusters
Benefits & Advantages
- Double-precision Tensor Cores delivering up to 535/268 teraFLOPS at FP64 in the 8-GPU/4-GPU respectively
- TF32 precision to reach nearly 8000 teraFLOPs for single-precision matrixmultiplication
- Superior thermal design and liquid cooling option supports maximum power/perfomance CPUs and GPUs
- Dedicated networking and storage per GPU with up to double the NVIDIA GPUDirect throughput of the previous generation
Key Features
- 4 or 8 H100 SXM GPUs with NVLink, interconnect with up to 900GB/s
- Dual 4th Gen Intel Xeon Scalable processors
- Supports PCIe 5.0, DDR5, and Compute Express Link (CXL) 1.1+
- Optimized thermal capacity and airflow to support CPUs up to 350W and GPUs up to 700W with air cooling and optional liquid cooling
- PCIe 5.0 x16 1:1 networking slots for GPUs up to 400 Gbps each supporting GPUDirect Storage and RDMA, and up to 16 U.2 NVMe drive bays, high throughput data pipeline and clustering
Accelerate Large Scale AI Training Workloads
Large-Scale AI training demands cutting-edge technologies to maximize parallel computing power of GPUs to handle billions if not trillions of AI model parameters to be trained with massive datasets that are exponentially growing.
Leverage NVIDIA’s HGX™ H100 SXM 4-GPU and the fastest NVLink™ & NVSwitch™ GPU-GPU interconnects with up to 900GB/s bandwidth, and fastest 1:1 networking to each GPU for node clustering, these systems are optimized to train large language models from scratch in the shortest amount of time.
5th Gen Intel® Xeon® Scalable Processors
- Up to 64 cores and 385W TDP per CPU
- Support for Intel Xeon® Max Series CPUs with High Bandwidth Memory
- Support for PCIe 5.0, DDR5 and CXL 1.1
- Built on the Intel® 7 process
- Built in accelerators:
- Intel AMX
- Intel® Dynamic Load Balancer
- Intel® QuickAssist
- Technology (QAT)
- Intel vRAN Boost
Delivering Solutions Optimized for Tomorrow’s Data Center Workloads
Complete Rack-Scale Solutions
- Full design, integration, validation and testing services for rack-scale and multi-rack clusters
- Complete rack-scale liquid cooling solutions developed in house
Performance and Energy Optimized
- Enhanced thermal capacity to support the highest performing CPUs and GPUs
- Optimized to run in high-temperature data center environments up to 40°C
Improved Security and Manageability
- Industry-standard compliance for hardware and silicon Root of Trust (RoT)
- Cryptographical attestation of components throughout the entire supply chain
Supports Open Industry Standards
- The latest industry technologies including PCIe 5.0, DDR5, and CXL
- Open Compute Project (OCP) standards including OCP 3.0, OAM, ORV2 and OSF as well as Open BMC