DP Intel 4U Direct-connect PCIe GPU Server with up to 8 GPUs

Anewtech Systems GPU Server Supermicro Singapore Superserver Supermicro Servers SYS-421GU-TNXR  Supermicro SYS-421GU-TNXR
  • 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 4800MHz ECC DDR5
  • 8 PCIe Gen 5.0 X16 LP Slots
  • Flexible networking options
  • 2 M.2 NVMe and SATA for boot drive only
  • 6x 2.5" Hot-swap  NVMe/SATA/SAS drive bays
Product Specification
Product SKUsSuperServer SYS-421GU-TNXR (Black Front & Silver Body)
MotherboardSuper X13DGU
CPUDual Socket E (LGA-4677)
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
Core CountUp to 56C/112T; Up to 112.5MB Cache per CPU
NoteSupports up to 350W TDP CPUs (Air Cooled)
Supports up to 350W TDP CPUs (Liquid Cooled)​
Max GPU Count4 onboard GPU(s)
Supported GPUNVIDIA SXM: HGX H100 4-GPU (80GB)
CPU-GPU InterconnectPCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU InterconnectNVIDIA® NVLink®
System Memory
MemorySlot Count: 32 DIMM slots
Max Memory (2DPC): Up to 8TB 5600MT/s ECC DDR5
Memory Voltage1.1 V
On-Board Devices
ChipsetIntel® C741
Network Connectivity2x 10GbE BaseT with Intel® X710-AT2
IPMISupport for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
Video1 VGA port(s)
System BIOS
SoftwareIPMI 2.0
KVM with dedicated LAN 
Super Diagnostics Offline 
SuperDoctor® 5
Supermicro Update Manager (SUM)
Supermicro Power Manager (SPM)
Supermicro Server Manager (SSM)
Redfish API
Power ConfigurationsACPI Power Management
Power-on mode for AC power recovery
HardwareTrusted Platform Module (TPM) 2.0
Silicon Root of Trust (RoT) – NIST 800-193 Compliant
FeaturesCryptographically Signed Firmware
Secure Boot
Secure Firmware Updates
Automatic Firmware Recovery
Supply Chain Security: Remote Attestation
Runtime BMC Protections
System Lockdown
PC Health Monitoring
CPU8+4 Phase-switching voltage regulator
Monitors for CPU Cores, Chipset Voltages, Memory
FANFans with tachometer monitoring
Pulse Width Modulated (PWM) fan connectors
Status monitor for speed control
TemperatureMonitoring for CPU and chassis environment
Thermal Control for fan connectors
Form Factor4U Rackmount
Dimensions and Weight
Height7" (175.6mm)
Width17.67" (449mm)
Depth32.79" (833mm)
Package14.57" (H) x 27.55" (W) x 49.6" (D)
WeightNet Weight: 105 lbs (48 kg) 
Gross Weight: 140 lbs (64 kg)
Available ColorBlack Front & Silver Body
Front Panel
ButtonsPower On/Off button
System Reset button
LEDsHard drive activity LED
Network activity LEDs
Power status LED
System Overheat & Power Fail LED
Expansion Slots
PCI-Express (PCIe)1 PCIe 5.0 x16 LP slot(s)
7 PCIe 5.0 X16 slot(s)
Drive Bays / Storage
Hot-swap6x 2.5" hot-swap NVMe/SATA drive bays
(6x 2.5" NVMe hybrid)
M.22 M.2 NVMe OR 2 M.2 SATA3
System Cooling
Fans5 heavy duty fans with optimal fan speed control
Air Shroud1 Air Shroud(s)
Liquid CoolingDirect to Chip (D2C) Cold Plate (optional)
Power Supply4x 3000W Redundant Titanium Level power supplies
Dimension (W x H x L)106.5 x 82.1 x 245.5 mm
AC Input3000W: 0240Vdc / 50-60Hz (for CQC only)
2880W: 200-207Vac / 50-60Hz 
3000W: 207-240Vac / 50-60Hz
+12VMax: 91.66A / Min: 0A (200Vdc-240Vdc)
12V SBMax: 3A / Min: 0A
Output TypeBackplanes (gold finger)
Operating Environment
Environmental Spec.Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) 
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) 
Operating Relative Humidity: 8% to 90% (non-condensing) 
Non-operating Relative Humidity: 5% to 95% (non-condensing)
HGX H100 Systems - Designed for Largest AI-fused HPC Clusters

Benefits & Advantages

  • Double-precision Tensor Cores delivering up to 535/268 teraFLOPS at FP64 in the 8-GPU/4-GPU respectively
  • TF32 precision to reach nearly 8000 teraFLOPs for single-precision matrixmultiplication
  • Superior thermal design and liquid cooling option supports maximum power/perfomance CPUs and GPUs
  • Dedicated networking and storage per GPU with up to double the NVIDIA GPUDirect throughput of the previous generation

Key Features

  • 4 or 8 H100 SXM GPUs with NVLink, interconnect with up to 900GB/s
  • Dual 4th Gen Intel Xeon Scalable processors
  • Supports PCIe 5.0, DDR5, and Compute Express Link (CXL) 1.1+
  • Optimized thermal capacity and airflow to support CPUs up to 350W and GPUs up to 700W with air cooling and optional liquid cooling
  • PCIe 5.0 x16 1:1 networking slots for GPUs up to 400 Gbps each supporting GPUDirect Storage and RDMA, and up to 16 U.2 NVMe drive bays, high throughput data pipeline and clustering

Accelerate Large Scale AI Training Workloads

Large-Scale AI training demands cutting-edge technologies to maximize parallel computing power of GPUs to handle billions if not trillions of AI model parameters to be trained with massive datasets that are exponentially growing. 

Leverage NVIDIA’s HGX™ H100 SXM 4-GPU and the fastest NVLink™ & NVSwitch™ GPU-GPU interconnects with up to 900GB/s bandwidth, and fastest 1:1 networking to each GPU for node clustering, these systems are optimized to train large language models from scratch in the shortest amount of time.

5th Gen Intel® Xeon® Scalable Processors

  • Up to 64 cores and 385W TDP per CPU
  • Support for Intel Xeon® Max Series CPUs with High Bandwidth Memory
  • Support for PCIe 5.0, DDR5 and CXL 1.1
  • Built on the Intel® 7 process
  • Built in accelerators:
    • Intel AMX
    • Intel® Dynamic Load Balancer
    • Intel® QuickAssist
    • Technology (QAT)
    • Intel vRAN Boost

Delivering Solutions Optimized for Tomorrow’s Data Center Workloads

Complete Rack-Scale Solutions

  • Full design, integration, validation and testing services for rack-scale and multi-rack clusters
  • Complete rack-scale liquid cooling solutions developed in house

Performance and Energy Optimized

  • Enhanced thermal capacity to support the highest performing CPUs and GPUs
  • Optimized to run in high-temperature data center environments up to 40°C

Improved Security and Manageability

  • Industry-standard compliance for hardware and silicon Root of Trust (RoT)
  • Cryptographical attestation of components throughout the entire supply chain

Supports Open Industry Standards

  • The latest industry technologies including PCIe 5.0, DDR5, and CXL
  • Open Compute Project (OCP) standards including OCP 3.0, OAM, ORV2 and OSF as well as Open BMC