P-RCO-3000-RPL
Small Form Factor Computer with LGA 1700 for Intel® Core™ (Series 2) / 14th / 13th / 12th Gen Processors & Q670E PCH, 2x LAN
- Intel® Core™ Processors (BTL, Series 2) / 14th / 13th / 12th Gen RPL/ADL Series, LGA1700
- Intel® Q670E Express Chipset
- 4x Independent Displays
- 2x Intel® 2.5GbE supporting Wake-on-LAN and PXE, 3x External SIM socket
- 2x 2.5" SATA SSD Bay (1x Internal) with RAID 0, 1, 5 support
- 1x M.2 E Key, 2230 (PCIe x1, USB 2.0)
- 1x M.2 B Key, 2242/3042/3052 (PCIe x2,or PCIe x1 & USB 3.2 Gen1; Support AI Module/NVMe Storage/4G/5G)
- 1x M.2 B Key, 2242/3042/3052 (PCIe x2 or SATA; Support AI Module/NVMe/SATA Storage/4G/5G)
- 3x RS-232/422/485, 6x USB 3.2 Gen 2 (10 Gbps)
- 8x DI + 8x DO with isolation
- 9 to 48VDC Wide Range Power Input Supporting AT/ATX Mode
- Wide Operating Temperature (-25°C to 70°C)
- TPM 2.0 Supported




The RCO-3000-RPL Series bringing powerful compute power to harsh industrial settings. At the heart of the RCO-3000-RPL Series is Intel’s 12/13/14th Generation advanced processors and Q670 Express Chipset, enabling advanced processing in volatile, demanding, and mobile deployments.
| System | |
| Processor | Standard 13th Gen Intel® Core™ Processors (Raptor Lake-S) Intel® Core™ i7-13700TE, 35W Intel® Core™ i5-13500TE, 35W 12th Gen Intel® Core™ Processors (Alder Lake-S) Intel® Core™ i7-12700TE, 35W Intel® Core™ i5-12500TE, 35W Project Based Intel® Core™ 3 / 5 / 7 (Series 2, Bartlett Lake-S, 45W) 14th Gen Intel® Core™ i3 / i5 / i7 / i9 (Raptor Lake-S Refresh, 35W) 13th Gen Intel® Core™ i3 / i5 / i7 / i9 (Raptor Lake-S, 35W) 12th Gen Intel® Core™ i3 / i5 / i7 / i9 (Alder Lake-S, 35W) |
| System Chipset | Intel® Q670E Express Chipset |
| LAN Chipset | 2.5 GbE1: Intel I226 (Support Wake-on-LAN and PXE, Support TSN) 2.5 GbE2: Intel I226 (Support Wake-on-LAN and PXE, Support TSN) |
| Audio Codec | Realtek ALC888S |
| System Memory | 1x DDR5 4800/5600 MT/s SO-DIMM Max. 48GB |
| Graphics | Integrated Intel® UHD Graphics 770/730 |
| BIOS | AMI 256Mbit SPI BIOS |
| Watchdog | Software Programmable Supports 1~255 sec. System Reset |
| AI Accelerator | Supports up to 4x Hailo-8™ modules |
| TPM | TPM 2.0 |
| Display | |
| Display Port | 4x DisplayPort 1.4a, support resolution 4096 x 2304, Up to 7680 x 4320 (1x DP Port Co-layout HDMI Connector) |
| HDMI | Yes, Shared by 1x DP port |
| Multiple Display | 4x Independent Displays |
| Storage | |
| SSD/HDD | 1x 9mm 2.5" SATA SSD Bay (Internal) 1x 7mm 2.5" SATA SSD Bay (Hot-swappable) Support RAID 0, 1, 5 |
| Expansion | |
| M.2 B-Key | 1x M.2 B key Type: 2242/3042/3052 • Support PCIe x2/PCIe x1 & USB 3.2 Gen1 • Support NVMe Storage/Hailo AI Module/4G/5G 1x M.2 B key Type: 2242/3042/3052 • Support PCIe x2/SATA signal • Support NVMe/SATA Storage/Hailo AI Module/4G/5G |
| M.2 E-Key | 1x M.2 E key slot (2230) • Support PCIe x1 & USB 2.0; Support CNVi • Support Wifi Module |
| SIM Socket | 1x External Mini SIM socket 1x External Dual Nano SIM socket |
| Expansion Modules | EDGEBoost I/O Bracket: • 4-port 1GbE module with Intel® I350 Chipset, RJ-45 or M12 connector (PoE optional) • 2-Port 10GbE RJ45 with Intel X710 Chipset • 4-Port USB with Renesas uPD720201K8 host controller (share PCIe Gen2 x1 bandwidth) • 1x RJ45 port for OOB Management Module • 1x M.2 M-Key (PCIe x4 Lane, 2242/2260) for NVMe/AI Module • 2x M.2 B-Key 2242/3042/3052: 2x M.2 (PCIe x2 Lane) for NVMe/AI Module or 1x M.2 (PCIe x2 Lane) for NVMe/AI Module and 1x M.2 (PCIe x1 Lane + USB 3.2 Gen 1) for 4G/5G Module, 1x External SIM socket (M.2 attached) |
| I/O | |
| Audio | 1x Line-out |
| CAN | 2x CAN 2.0 A/B 2-pin Internal header |
| COM | 3x RS-232/422/485; 2x RS-232/422/485 Internal header |
| DIO | 8 in / 8 out (Isolated) |
| LAN | 2x 2.5GbE RJ45 |
| USB | 6x USB 3.2 Gen 2 (10Gbps) |
| Others | 5x WiFi Antenna Holes 1x Power Switch, 1x AT/ATX Switch, 1x Remote Power On/Off 1x PC/Car Mode Switch, 1x Delay Time Switch 1x Clear CMOS Switch 1x Mic In Header (Internal) |
| Operating System | |
| Windows | Windows 10/11 |
| Linux | Linux kernel 5.x |
| Power | |
| Power Adapter | Optional AC/DC 24V/9.2A, 220W Optional AC/DC 24V/11.67A, 280W |
| Power Mode | AT, ATX |
| Power Ignition Sensing | Power Ignition Management |
| Power Supply Voltage | 9~48VDC |
| Power Connector | 3-pin Terminal Block |
| Power Protection | OVP (Over Voltage Protection) OCP (Over Current Protection) Reverse Protection |
| Environment | |
| Operating Temperature | -25°C to 70°C (35W/45W CPU) |
| Storage Temperature | -30°C to 85°C |
| Relative Humidity | 10% to 95% (non-condensing) |
| Certification | UL 61010-1, 3rd Ed UL 61010-2-201, Edition 2 CE, FCC Class A EMC Conformity with EN50121-3-2 |
| Vibration | With HDD: 1 Grms (5500 Hz, 0.5 hr/axis) With SSD: 5 Grms (5500 Hz, 0.5 hr/axis) |
| Shock | With SSD: 50G half-sin 11ms |
| Physical | |
| Dimensions | 192 (W) x 227 (D) x 69.5 (H) mm |
| Weights | 55.4KG |
| Construction | Extruded Aluminum with Heavy Duty Metal |
| Mounting Options | Wall Mounting kit with Vibration Isolation DIN Rail Mounting (optional) |
RCO-3000-RPL Series
Small Form Factor Computer with LGA 1700 for Intel® Core™ (Series 2) / 14th / 13th / 12th Gen Processors & Q670E PCH, 2x LAN
The RCO-3000-RPL Series is a super-rugged x86 small form factor computer designed for real-time edge processing, rich IoT connectivity, and scalable EDGEBoost I/O technology. Despite its small footprint, it utilizes a high-performance socket-type CPU to handle resource-intensive tasks efficiently. Its fanless, cableless design ensures maximum durability and reliability in challenging space-constrained environments.

Edge Workload Ready: Hybrid P & E Cores
- Intel® Core™ Processors 12th/13th Gen (ADL/RPL) and Series 2 (BTL)
- Up to 24 Cores (8 P-Cores, 16 E-Cores)
- Up to 32 Threads
- Additional L2 & L3 Cache
DDR5 Speed for Volatile Workloads
1x DDR5 4800/5600MHz SODIMM

Modular EDGEBoost I/O: Flexible IoT Connectivity

M.2 Performance Acceleration
2x M.2 B-Key for: NVMe/SATA storage, Edge AI TPU, 5G
1x M.2 E-Key for: WiFi 6E


Hot-swappable High-Capacity SATA
- 1x Internal 2.5” SATA SSD Bay
- 1x Hot-swappable 2.5” SATA SSD Bay
Automation & Mobile IoT Ready
- 16-bit Isolated DIO (8in, 8out)
- CAN Bus (2-channel)
- Power Ignition Management
- WiFi 6E
- Bluetooth 5.3
- 5G/4G/LTE


Built Super-Rugged. Built Ready
- Wide Operating Temperatures (-25℃ to 70℃)
- Shock & Vibration Resistance (MIL-STD-810G)
- Wide Power Input (9~48VDC)
- Power Protection (OCP, OVP, RPP)
Mechanical Layout

Product Dimension

RCO SERIES: SUPER-RUGGED INDUSTRIAL COMPUTERS
The RCO Series is a line of super-rugged x86 industrial computers purpose-built to enable real-time performance in extreme deployments. By leveraging a fanless and cableless design approach with modular EDGEBoost technologies, these systems can provide seamless configurability to meet varying edge-native deployment requirements while maintaining utmost durability. Available in three series, the RCO-1000, RCO-3000, and RCO-6000 Series.

Intel Atom® Processors
- Up to 3x EDGEBoost I/O
- Lite AI Performance
- Up to 2x PoE and 2x LAN RJ45
- Wide Operating Temperature -40°C up to 70°C

Intel® Core Processors
- 1x EDGEBoost I/O
- Mid-AI Performance
- Up to 4x PoE RJ45/M12
- Wide Operating Temperature -25°C up to 70°C
- EN50155 (EMC) Certified

Intel® Core Processors
- 2x EDGEBoost I/O
- High-AI Performance
- Up to 8x PoE RJ45/M12
- EDGEBoost Nodes Compatible for SSD, GPU and PCIe expansions
- Wide Operating Temperature -25°C up to 70°C
RCO Series: Intel x86 Super-Rugged Edge AI PCs
The RCO series is known for its x86 compute architecture and super rugged features, designed to withstand extreme environments. It consists of three models - RCO 1000, RCO 3000, and RCO 6000 - each tailored to specific performance needs.
It can operate in freezing cold to scorching heat, resist dust, shock, and vibration, making it ideal for harsh industrial and environmental settings. It offers multi-core Intel x86 compute and GPU acceleration capabilities, making it suitable for computer vision and data acquisition in the most demanding applications.