SYS-211E-FRN2T
2U Short-depth front I/O System with 2 x 10G ports, 2x 2.5" NVMe drive bays and redundant AC PSU
- Design with compliance to NEBS-Level 3
- Single Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors
- 8 DIMM slots; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM
- Up to 3 PCIe 5.0 x16 FHHL, 1 PCIe 5.0 X16 HHHL & 1 PCIe 5.0 x8 FHHL expansion slots for Accelerator Add-On-Cards
- Onboard 2x 10GbE ports
- 2x 2.5" drive bays for NVMe drives
- Redundant 800W AC Power Supplies
- Ultra short depth, 2U Front I/O Edge Server
Datasheet
Product Specification
| Product SKUs | SuperServer SYS-211E-FRN2T (Silver/Black) |
| Motherboard | Super X13SEM-TF |
| Processor | |
| CPU | Single Socket E (LGA-4677) 5th Gen Intel® Xeon®/ 4th Gen Intel® Xeon® Scalable processors |
| Core Count | Up to 60C/120T; Up to 112.5MB Cache per CPU |
| Note | Supports up to 350W TDP CPUs (Air Cooled)* *Air Cooled CPUs with TDP over 205W only supported under specific conditions. |
| GPU | |
| Max GPU Count | Up to 3 single-width GPU(s) |
| Supported GPU | Intel PCIe: Intel Data Center GPU Flex 140NVIDIA PCIe: A2 |
| CPU-GPU Interconnect | PCIe 5.0 x16 CPU-to-GPU Interconnect |
| GPU-GPU Interconnect | PCIe |
| System Memory | |
| Memory | Slot Count: 8 DIMM slots Max Memory (2DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM |
| Memory Voltage | 1.1 V |
| On-Board Devices | |
| NVMe | NVMe; RAID 0/1 support (Intel® VROC RAID Key required) |
| Chipset | Intel® C741 |
| Network Connectivity | 2x 25GbE QSFP28 with Intel® XXV710 (optional) 2x 25GbE QSFP28 with Intel® E810-CAM1 (optional) 2x 40GbE QSFP+ with Intel® XL710-BM2 (optional) 2x 10GbE SFP+ with Intel® X710-BM2 (optional) 4x 1GbE BaseT with Intel® i350 (optional) 2x 200GbE QSFP56 with Mellanox® MT28908A0-XCCF-HVM (optional) 2x 10GbE BaseT with Intel® X550 2x 100GbE QSFP28 with Intel® E810-CAM2 (optional) |
| IPMI | Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support |
| Input / Output | |
| LAN | 1 RJ45 Dedicated BMC LAN port2 RJ45 10GbE (Intel® X550-AT2) |
| USB | 2 USB 2.0 port(s) (2 front)2 USB 3.0 port(s) (2 front) |
| Video | 1 VGA port(s) |
| Serial Port | 1 COM Port(s) (1 front) |
| System BIOS | |
| BIOS Type | AMI 256MB SPI Flash |
| Management | |
| Software | SUM SSM Redfish API IPMI 2.0 Intel® Node Manager SPM KVM with dedicated LAN NMIWatch Dog SuperDoctor® 5 IPMI 2.0 |
| Power Configurations | ACPI Power Management |
| PC Health Monitoring | |
| CPU | Monitors for CPU Cores, Chipset Voltages, Memory |
| FAN | Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control |
| Temperature | CPU thermal trip support, PEPI Monitoring for CPU and chassis environment |
| Chassis | |
| Form Factor | 2U Rackmount |
| Model | CSE-211M |
| Dimensions and Weight | |
| Height | 3.5" (88.9mm) |
| Width | 17.2" (436.88mm) |
| Depth | 11.8" (298.8mm) |
| Package | 7.4" (H) x 19.3" (W) x 23.3" (D) |
| Weight | Net Weight: 17 lbs (7.7 kg) Gross Weight: 22 lbs (10 kg) |
| Available Color | Silver/Black |
| Front Panel | |
| Buttons | Power On/Off UID button |
| LEDs | HDD activityLAN1 activity LAN2 activityPower statusSystem information |
| Expansion Slots | |
| PCI-Express (PCIe) | 1 PCIe 5.0 x16 HHHL slot(s) 1 PCIe 5.0 x8 HHHL slot(s) 2 PCIe 5.0 x16 FHHL slot(s) |
| Drive Bays / Storage | |
| Hot-swap | 2x 2.5" hot-swap NVMe drive bays (2x 2.5" NVMe dedicated) |
| M.2 | 2 M.2 NVMeM-Key, 2280/22110 |
| System Cooling | |
| Fans | 4x 4-PIN PWM 8cm Fan(s) |
| Power Supply | 800W Redundant AC 100-240V Power Supplies with PMBus |
| Dimension (W x H x L) | 54.5 x 40 x 220 mm |
| Operating Environment | |
| Environmental Spec. | Operating Temperature: 0°C ~ 35°C (32°F ~ 95°F) Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
5G Edge and IoT: Compact and Short-depth Systems for Telco and Network Edge Deployments
5G Edge and IoT solutions are uniquely designed to deliver high performance compute capabilities to remote environments, combining ease of use in virtualized applications with data-center-level security and performance for 5G telco, retail, network virtualization and smart city applications. Through Supermicro’s proven Building Block Solutions architecture, these systems incorporate many of the design features proven in traditional data centers to maximize performance at the edge.
Designed for remote and space-constrained telco environments, these short-depth and compact systems are available with both AC and DC redundant power options as well as NEBScompliant designs on some architectures to easily integrate into existing edge infrastructure.
High-density processing power and data throughput with front access I/O design
Data Center Compute at the Network Edge
- Single 5th/4th Gen Intel® Xeon® Scalable processor
- Flexible configuration with up to 4 slots in 2U
- RJ45 10GbE or SFP 25Gb network connectivity
- Front I/O, power and serviceability for space constrained edge environments
- Both AC and DC power configurations available with redundant power supplies
- Enhanced operating temperatures from -5ºC to 45ºC (CPU TDP-dependent)
5th Gen Intel® Xeon® Scalable Processors
- Up to 64 cores and 385W TDP per CPU
- Support for Intel Xeon® Max Series CPUs with High Bandwidth Memory
- Support for PCIe 5.0, DDR5 and CXL 1.1
- Built on the Intel® 7 process
- Built in accelerators:
- Intel AMX
- Intel® Dynamic Load Balancer
- Intel® QuickAssist
- Technology (QAT)
- Intel vRAN Boost
Delivering Solutions Optimized for Tomorrow’s Data Center Workloads
Complete Rack-Scale Solutions
- Full design, integration, validation and testing services for rack-scale and multi-rack clusters
- Complete rack-scale liquid cooling solutions developed in house
Performance and Energy Optimized
- Enhanced thermal capacity to support the highest performing CPUs and GPUs
- Optimized to run in high-temperature data center environments up to 40°C
Improved Security and Manageability
- Industry-standard compliance for hardware and silicon Root of Trust (RoT)
- Cryptographical attestation of components throughout the entire supply chain
Supports Open Industry Standards
- The latest industry technologies including PCIe 5.0, DDR5, and CXL
- Open Compute Project (OCP) standards including OCP 3.0, OAM, ORV2 and OSF as well as Open BMC